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Circuit board gold-plated zedoary relevant comparison
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If the subdivision plating, plating is divided into many types, let's explain what type of plating plating points:
A: the entire board gold.
Generally refers to the [gold] [electroless nickel plating gold plate], [electrolytic gold], [Gold], [] electroless nickel gold plate, with soft gold and hard gold (generally used as Goldfinger) distinction. The principle is the nickel and gold (commonly known as the gold salt) dissolved in a chemical solution, the circuit board is immersed in the plating tank and pass on the current generation of nickel and gold plating on the surface of the circuit board copper, electroless nickel plating gold because high hardness, wear resistance, easy oxidation characteristics of the electronic product names are widely used.
II: Immersion Gold:
The method of reduction reaction by chemical oxidation of the coating layer, generally thicker, a chemical nickel gold layer deposition method, can achieve a thicker gold layer, typically called immersion gold.
Three: gold plate
With the increasing integration of IC, IC foot the more dense. The vertical HASL process is difficult to become thin pads blow formation, which gives the SMT placement brings difficulty; another HASL of inactive life (shelf life) is very short. The gold plate just to solve these problems: 1 for surface mount technology, especially for the 0603 and 0402 ultra-small surface-mount, because the pad flatness is directly related to the quality of solder paste printing process, reflow soldering on the back of the quality of play the decisive influence, so the entire board gold often seen in high-density and ultra-small surface mount process. 2 In the trial stage, the impact of component procurement and other factors the board more often than not come immediately welding, but often have to wait a few weeks or even a month before use, gold plate stand life (shelf life) than tin alloy long many times so we are happy to adopt. Besides gold-plated PCB in degree and kind of stage cost almost the same compared to the pewter plate.
But as more and more dense wiring, line width, spacing has to 3-4MIL. Therefore, the short-circuit problem brought gold:
With the increasing frequency of the signal due to the skin effect affect signal transmission in the case of multi-coating on the signal quality, the more obvious:
Skin effect refers to: a high-frequency alternating current, the current will tend to concentrate on the wire surface flow.
According to calculations, the skin depth and frequency-dependent:
Other disadvantages are listed in gilded plate immersion gold plate and gold plate the difference table.
Four: Immersion Gold board
To solve the above problem gilded plate, using Immersion Gold PCB board has the following characteristics:
1, due to the crystal structure formed by immersion gold and gold-plated is not the same, gold will be golden brown is more yellow than the gilt, customer satisfaction.
2, due to the crystal structure formed by immersion gold and gold-plated is not the same, gold would be easier than the gold-plated soldering, no adverse welding, causing customer complaints.
3, due to gold-plate nickel-gold on the pad only, the transmission of signals in the skin effect in the copper layer does not affect the signal.
4, due to immersion gold than the gold-plated crystal structure for a more compact, easy to produce an oxide.
5, due to gold-plate only to have nickel and gold on the pad, so it will not yield to cause micro short gold.
6, due to gold-plate only to have nickel and gold on the pad, so the combination of solder and copper layer more firmly on the line.
7, the project will not have an impact in making compensation for spacing.
8, because the crystal structure formed by immersion gold and gold-plated is not the same, and its gold-plate stress is easier to control, to have the bonding of products, more conducive to bonding processing. But also because of heavy gold than gold-plated soft, so gold-plate Goldfinger do not wear.
A: the entire board gold.
Generally refers to the [gold] [electroless nickel plating gold plate], [electrolytic gold], [Gold], [] electroless nickel gold plate, with soft gold and hard gold (generally used as Goldfinger) distinction. The principle is the nickel and gold (commonly known as the gold salt) dissolved in a chemical solution, the circuit board is immersed in the plating tank and pass on the current generation of nickel and gold plating on the surface of the circuit board copper, electroless nickel plating gold because high hardness, wear resistance, easy oxidation characteristics of the electronic product names are widely used.
II: Immersion Gold:
The method of reduction reaction by chemical oxidation of the coating layer, generally thicker, a chemical nickel gold layer deposition method, can achieve a thicker gold layer, typically called immersion gold.
Three: gold plate
With the increasing integration of IC, IC foot the more dense. The vertical HASL process is difficult to become thin pads blow formation, which gives the SMT placement brings difficulty; another HASL of inactive life (shelf life) is very short. The gold plate just to solve these problems: 1 for surface mount technology, especially for the 0603 and 0402 ultra-small surface-mount, because the pad flatness is directly related to the quality of solder paste printing process, reflow soldering on the back of the quality of play the decisive influence, so the entire board gold often seen in high-density and ultra-small surface mount process. 2 In the trial stage, the impact of component procurement and other factors the board more often than not come immediately welding, but often have to wait a few weeks or even a month before use, gold plate stand life (shelf life) than tin alloy long many times so we are happy to adopt. Besides gold-plated PCB in degree and kind of stage cost almost the same compared to the pewter plate.
But as more and more dense wiring, line width, spacing has to 3-4MIL. Therefore, the short-circuit problem brought gold:
With the increasing frequency of the signal due to the skin effect affect signal transmission in the case of multi-coating on the signal quality, the more obvious:
Skin effect refers to: a high-frequency alternating current, the current will tend to concentrate on the wire surface flow.
According to calculations, the skin depth and frequency-dependent:
Other disadvantages are listed in gilded plate immersion gold plate and gold plate the difference table.
Four: Immersion Gold board
To solve the above problem gilded plate, using Immersion Gold PCB board has the following characteristics:
1, due to the crystal structure formed by immersion gold and gold-plated is not the same, gold will be golden brown is more yellow than the gilt, customer satisfaction.
2, due to the crystal structure formed by immersion gold and gold-plated is not the same, gold would be easier than the gold-plated soldering, no adverse welding, causing customer complaints.
3, due to gold-plate nickel-gold on the pad only, the transmission of signals in the skin effect in the copper layer does not affect the signal.
4, due to immersion gold than the gold-plated crystal structure for a more compact, easy to produce an oxide.
5, due to gold-plate only to have nickel and gold on the pad, so it will not yield to cause micro short gold.
6, due to gold-plate only to have nickel and gold on the pad, so the combination of solder and copper layer more firmly on the line.
7, the project will not have an impact in making compensation for spacing.
8, because the crystal structure formed by immersion gold and gold-plated is not the same, and its gold-plate stress is easier to control, to have the bonding of products, more conducive to bonding processing. But also because of heavy gold than gold-plated soft, so gold-plate Goldfinger do not wear.
9, gold plate and stand longevity and smoothness as good as gold plate.
NanJing DingYing Electronics Technology Co., LTD.