Technology
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- Reduce the vehicle PCB defect rate of the six major methods
- Why should the PCB board "paste gold"
- PCB hole without copper bad analysis
- Some small principles of PCB copying process
- Double-sided Process
- Multi Version Technique
- Process technology index
- Assurance process
- Management System
- The Inspection and Test
- Printed circuit boards introduce common standards
- PCB design: to reduce noise and electromagnetic interference 24 tips
- Factors affecting impedance PCB processing
- Circuit board gold-plated zedoary relevant comparison
- The difference between gold and gold-plated PCB board Shen board
- PCB circuit board inspection and prevention of short circuit
- The hole broke, the hole wall with copper particles, there are copper, I would like to ask that a few pots of medicine out of the question?
- How to maintain the circuit board to extend the service life
Printed circuit boards introduce common standards
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1) IPC-ESD-2020: Electrostatic Discharge joint standard control program development. ESD control program including the necessary design , create, implement and maintain. Based on historical experience some military organizations and commercial organizations for electrostatic discharge protection of the sensitive period for processing and to provide guidance .
2) IPC-SA-61 A: After soldering semi- aqueous cleaning manual. Including all aspects of the semi- aqueous cleaning , including chemical , manufacturing residues , equipment, technology , process control , and environmental and safety considerations.
3) IPC-AC-62A: manual cleaning after soldering into the water . Description manufacturing residues, aqueous detergent type and nature of water into a clean process , equipment and processes , quality control , environmental control and employee safety and cleanliness of the cost of measurement and determination .
4) IPC-DRM -4 0E: through-hole solder joint assessment Desktop Reference Manual . According to detailed description of the standard components of the cell wall and the welding surface of the cover , etc. , in addition to comprising a computer -generated 3D graphics. Fill tin covers , contact angle, wetting , vertical fill , pad cover and numerous weld defects circumstances .
5) IPC-TA-722: Welding Technology Assessment Manual . Including information on all aspects of welding technology 45 articles , covering general welding , welding materials, hand soldering , bulk welding, wave soldering , reflow soldering , gas welding and infrared welding.
6) IPC-7525: Template Design Guide. I provide guidelines for the design and manufacture of surface mount solder paste and adhesive coated template template design also discussed the application of surface mount technology , and introduced ? Queensland together with a through -hole or flip chip components technology, including overprint , two -stage template design and printing .
7) IPC / EIA J-STD-004: a flux specification requirements included in Appendix I. Technical indicators and categories containing rosin, resin, etc. , according to the content and activation halide flux classification of organic and inorganic fluxes ; also includes the use of flux , low -clean materials and processes used in containing flux residual flux.
8) IPC / EIA J-STD -005: needs a solder paste specifications including Appendix I. Shows the characteristics of the solder paste needs and specifications , including standard test methods and the metal content , and viscosity , falling powder, wetting properties of the solder balls , solder paste , and the viscosity .
9) IPC / EIA J-STD -0 06A: electronic grade solder alloys, solder flux and non- flux solid specification requirements. Electronic grade solder alloys , rod-shaped , ribbon , powdered flux and non- flux solder for electronic soldering applications for electronic grade solder provides special nomenclature , specifications, requirements and test methods.
10) IPC-Ca-821: Common thermal adhesive requirements. Including the components adhered to the requirements and test methods suitable thermally conductive dielectric position .
11) IPC-3406: a conductive surface coating binders Guide . In electronics manufacturing , solder alternatively to provide guidance for selection of the conductive adhesive .
12) IPC-AJ- 820: assembling and welding manual. Contains assembly and welding inspection techniques described , including terminology and definitions ; Material Type printed circuit boards, components and pins , welding points , components, installation, design specifications reference and outline ; welding technology and packaging ; cleaning and coating ; quality assurance and testing .
13) IPC-7530: Batch welding process ( reflow and wave soldering ) temperature curve guide . Using a variety of testing methods , techniques and methods to get the temperature curve , and provide guidance for the establishment of the best graphics.
14) IPC-TR- 460A: wave soldering of printed circuit board troubleshooting list. A list of measures that might be corrected by a fault caused by wave soldering and is recommended.
15) IPC / EIA / JEDEC J-STD-003A. Soldering printed circuit board testing .
16) J-STD-0 13: foot ball grid array package (SGA) and other high -density technology. Printed circuit board packaging process to establish the required specification requirements and interactions , providing information for high-performance and high pin count IC package interconnect , including design principles of information , choice of materials , board manufacturing and assembly techniques , testing methods based on end-use environment and the reliability of expectations.
17) IPC-7095: SGA device design and assembly processes supplement . Offers a variety of useful information for the operation of the device you are using or considering SGA people go to this area array package ; provide guidance and to provide reliable information on the field for the SGA SGA detection and repair.
18) IPC-M-I 08: Cleaning instruction manual . Including the latest version of the IPC cleaning guide , in the manufacturing process engineers decided to cleaning products and failure to provide help for their exclusion .
IPC-CH-65-A: printed circuit board assembly cleaning guide title # e # 19) IPC-CH- 65-A: printed circuit board assembly cleaning guide . Provide a reference for the electronics industry and the current cleaning method that emerging including a description and discussion of various cleaning methods , explains the relationship between the various materials in the manufacturing and assembly operations , processes, and between pollutants .
20) IPC-SC- 60A: manual cleaning solvent after soldering . Gives automatic welding and manual welding techniques using solvent cleaning , discusses the nature of the solvent , the residue problem and the process control and environmental aspects .
21) IPC-9201: Surface Insulation Resistance Handbook . Including surface insulation resistance (SIR) terminology , theory, test procedures and test methods , further including temperature, humidity (TH) , fault mode and troubleshooting .
22) IPC-DRM- 53: Introduction to electronics assembly Desktop Reference Manual . Used to describe the through-hole and surface mount assembly technology icons and photos.
23) IPC-M-103: standard surface mount assembly manual . This section includes all 21 IPC documents related to surface mount .
24) IPC-M-I 04: Printed circuit board assembly manual standards. Contains 10 of the most widely used document on the printed circuit board assembly .
25) IPC-CC- 830B: printed circuit board assembly and identification of performance in electrical insulating compound. Conformal coatings meet the quality and qualifications of an industry standard.
26) IPC-S-816: surface mount technology process guidelines and checklists . The Troubleshooting Guide lists all types of process problems encountered in surface mount assembly and their solutions , including bridges , weld , and other components placed malalignment .
27) IPC-CM- 770D: printed circuit board components installation guide. Ready to provide printed circuit board assembly components effective guidance and review of relevant standards , influence, and the issue , including assembly techniques ( including manual and automatic , and surface mount technology and flip chip assembly technology ) and consider the follow-up welding, cleaning and coating processes.
28) IPC-7129: Fault number (DPMO) is calculated and printed circuit board assembly manufacturing index per million opportunities . For the calculation of defects and quality-related industrial sectors agreed benchmarks ; number of faults benchmark provides a satisfactory way it happened was calculated per million opportunities.
29) IPC-9261: printed circuit board assembly production is estimated to be in the assembly and failure occur per million opportunities . Defines a printed circuit board assembly and reliable calculation method of the number of failures per million opportunities for , the various stages of the assembly process evaluation measure.
30) IPC-D-279: reliable surface mount technology printed circuit board assembly design guidelines . Surface mount technology and hybrid technology printed circuit board manufacturing process reliability guidelines, including design ideas .
31) IPC-2546: printed circuit board assembly passed the point of portfolio needs. Describes the material movement systems, such as transmission and buffers , hand placement, automatic screen printing, adhesive automatic distribution , automatic SMT placement, automatic plated through -hole placement , forced convection , infrared reflow oven and wave soldering .
32) IPC-PE- 740A: Printed circuit board manufacturing and assembly troubleshooting . Printed circuit products including cases of problems in the design , manufacture, assembly and testing process for recording and correction activities.
33) IPC-6010: printed circuit board quality standards and performance specifications series manual. Including the American Association for the printed circuit board quality standards and performance specifications for all standard printed circuit board making.
34) IPC-6018A: Microwave finished printed circuit board inspection and testing . Including high frequency ( microwave ) printing performance and eligibility requirements of the board.
35) IPC-D-317A: high-speed technology of electronic packaging design guidelines . Provide guidance for the design of high-speed circuits , including mechanical and electrical considerations and performance testing .
2) IPC-SA-61 A: After soldering semi- aqueous cleaning manual. Including all aspects of the semi- aqueous cleaning , including chemical , manufacturing residues , equipment, technology , process control , and environmental and safety considerations.
3) IPC-AC-62A: manual cleaning after soldering into the water . Description manufacturing residues, aqueous detergent type and nature of water into a clean process , equipment and processes , quality control , environmental control and employee safety and cleanliness of the cost of measurement and determination .
4) IPC-DRM -4 0E: through-hole solder joint assessment Desktop Reference Manual . According to detailed description of the standard components of the cell wall and the welding surface of the cover , etc. , in addition to comprising a computer -generated 3D graphics. Fill tin covers , contact angle, wetting , vertical fill , pad cover and numerous weld defects circumstances .
5) IPC-TA-722: Welding Technology Assessment Manual . Including information on all aspects of welding technology 45 articles , covering general welding , welding materials, hand soldering , bulk welding, wave soldering , reflow soldering , gas welding and infrared welding.
6) IPC-7525: Template Design Guide. I provide guidelines for the design and manufacture of surface mount solder paste and adhesive coated template template design also discussed the application of surface mount technology , and introduced ? Queensland together with a through -hole or flip chip components technology, including overprint , two -stage template design and printing .
7) IPC / EIA J-STD-004: a flux specification requirements included in Appendix I. Technical indicators and categories containing rosin, resin, etc. , according to the content and activation halide flux classification of organic and inorganic fluxes ; also includes the use of flux , low -clean materials and processes used in containing flux residual flux.
8) IPC / EIA J-STD -005: needs a solder paste specifications including Appendix I. Shows the characteristics of the solder paste needs and specifications , including standard test methods and the metal content , and viscosity , falling powder, wetting properties of the solder balls , solder paste , and the viscosity .
9) IPC / EIA J-STD -0 06A: electronic grade solder alloys, solder flux and non- flux solid specification requirements. Electronic grade solder alloys , rod-shaped , ribbon , powdered flux and non- flux solder for electronic soldering applications for electronic grade solder provides special nomenclature , specifications, requirements and test methods.
10) IPC-Ca-821: Common thermal adhesive requirements. Including the components adhered to the requirements and test methods suitable thermally conductive dielectric position .
11) IPC-3406: a conductive surface coating binders Guide . In electronics manufacturing , solder alternatively to provide guidance for selection of the conductive adhesive .
12) IPC-AJ- 820: assembling and welding manual. Contains assembly and welding inspection techniques described , including terminology and definitions ; Material Type printed circuit boards, components and pins , welding points , components, installation, design specifications reference and outline ; welding technology and packaging ; cleaning and coating ; quality assurance and testing .
13) IPC-7530: Batch welding process ( reflow and wave soldering ) temperature curve guide . Using a variety of testing methods , techniques and methods to get the temperature curve , and provide guidance for the establishment of the best graphics.
14) IPC-TR- 460A: wave soldering of printed circuit board troubleshooting list. A list of measures that might be corrected by a fault caused by wave soldering and is recommended.
15) IPC / EIA / JEDEC J-STD-003A. Soldering printed circuit board testing .
16) J-STD-0 13: foot ball grid array package (SGA) and other high -density technology. Printed circuit board packaging process to establish the required specification requirements and interactions , providing information for high-performance and high pin count IC package interconnect , including design principles of information , choice of materials , board manufacturing and assembly techniques , testing methods based on end-use environment and the reliability of expectations.
17) IPC-7095: SGA device design and assembly processes supplement . Offers a variety of useful information for the operation of the device you are using or considering SGA people go to this area array package ; provide guidance and to provide reliable information on the field for the SGA SGA detection and repair.
18) IPC-M-I 08: Cleaning instruction manual . Including the latest version of the IPC cleaning guide , in the manufacturing process engineers decided to cleaning products and failure to provide help for their exclusion .
IPC-CH-65-A: printed circuit board assembly cleaning guide title # e # 19) IPC-CH- 65-A: printed circuit board assembly cleaning guide . Provide a reference for the electronics industry and the current cleaning method that emerging including a description and discussion of various cleaning methods , explains the relationship between the various materials in the manufacturing and assembly operations , processes, and between pollutants .
20) IPC-SC- 60A: manual cleaning solvent after soldering . Gives automatic welding and manual welding techniques using solvent cleaning , discusses the nature of the solvent , the residue problem and the process control and environmental aspects .
21) IPC-9201: Surface Insulation Resistance Handbook . Including surface insulation resistance (SIR) terminology , theory, test procedures and test methods , further including temperature, humidity (TH) , fault mode and troubleshooting .
22) IPC-DRM- 53: Introduction to electronics assembly Desktop Reference Manual . Used to describe the through-hole and surface mount assembly technology icons and photos.
23) IPC-M-103: standard surface mount assembly manual . This section includes all 21 IPC documents related to surface mount .
24) IPC-M-I 04: Printed circuit board assembly manual standards. Contains 10 of the most widely used document on the printed circuit board assembly .
25) IPC-CC- 830B: printed circuit board assembly and identification of performance in electrical insulating compound. Conformal coatings meet the quality and qualifications of an industry standard.
26) IPC-S-816: surface mount technology process guidelines and checklists . The Troubleshooting Guide lists all types of process problems encountered in surface mount assembly and their solutions , including bridges , weld , and other components placed malalignment .
27) IPC-CM- 770D: printed circuit board components installation guide. Ready to provide printed circuit board assembly components effective guidance and review of relevant standards , influence, and the issue , including assembly techniques ( including manual and automatic , and surface mount technology and flip chip assembly technology ) and consider the follow-up welding, cleaning and coating processes.
28) IPC-7129: Fault number (DPMO) is calculated and printed circuit board assembly manufacturing index per million opportunities . For the calculation of defects and quality-related industrial sectors agreed benchmarks ; number of faults benchmark provides a satisfactory way it happened was calculated per million opportunities.
29) IPC-9261: printed circuit board assembly production is estimated to be in the assembly and failure occur per million opportunities . Defines a printed circuit board assembly and reliable calculation method of the number of failures per million opportunities for , the various stages of the assembly process evaluation measure.
30) IPC-D-279: reliable surface mount technology printed circuit board assembly design guidelines . Surface mount technology and hybrid technology printed circuit board manufacturing process reliability guidelines, including design ideas .
31) IPC-2546: printed circuit board assembly passed the point of portfolio needs. Describes the material movement systems, such as transmission and buffers , hand placement, automatic screen printing, adhesive automatic distribution , automatic SMT placement, automatic plated through -hole placement , forced convection , infrared reflow oven and wave soldering .
32) IPC-PE- 740A: Printed circuit board manufacturing and assembly troubleshooting . Printed circuit products including cases of problems in the design , manufacture, assembly and testing process for recording and correction activities.
33) IPC-6010: printed circuit board quality standards and performance specifications series manual. Including the American Association for the printed circuit board quality standards and performance specifications for all standard printed circuit board making.
34) IPC-6018A: Microwave finished printed circuit board inspection and testing . Including high frequency ( microwave ) printing performance and eligibility requirements of the board.
35) IPC-D-317A: high-speed technology of electronic packaging design guidelines . Provide guidance for the design of high-speed circuits , including mechanical and electrical considerations and performance testing .
11) IPC-3406: 导电表面涂敷粘结剂指南。在电子制造中为作为焊锡备选的导电粘结剂的选择提供指导。
12) IPC-AJ-820: 组装和焊接手册。包含对组装和焊接的检验技术的描述，包括术语和定义;印制电路板、元器件和引脚的类型、焊接点的材料、元器件安装、设计的规范参考和大纲;焊接技术和封装;清洗和覆膜;质量保证和测试。
13) IPC-7530: 批量焊接过程(回流焊接和波峰焊接)温度曲线指南。在温度曲线获取中采用各种测试手段、技术和方法，为建立最佳图形提供指导。
14) IPC-TR-460A: 印制电路板波峰焊接故障排除清单。为可能由波峰焊接引起的故障而推荐的一个修正措施清单。
15) IPC/EIA/JEDEC J-STD-003A。印制电路板的焊接性测试。
16) J-STD-0 13: 球脚格点阵列封装(SGA) 和其他高密度技术的应用。建立印制电路板封装过程所需的规格需求和相互作用，为高性能和高引脚数目集成电路封装互连提供信息，包括设计原则信息、材料的选择、板子的制造和组装技术、测试方法和基于最终使用环境的可靠性期望。
17) IPC-7095: SGA 器件的设计和组装过程补充。为正在使用SGA 器件或考虑转到阵列封装形式这一领域的人们提供各种有用的操作信息;为SGA 的检测和维修提供指导并提供关于SGA 领域的可靠信息。
18) IPC-M-I08: 清洗指导手册。包括最新版本的IPC 清洗指导，在制造工程师决定产品的清洗过程和故障排除时为他们提供帮助。
IPC-CH-65-A: 印制电路板组装中的清洗指南题#e#19) IPC-CH-65-A: 印制电路板组装中的清洗指南。为电子工业中目前使的和新出现的清洗方法提供参考，包括对各种清洗方法的描述和讨论，解释了在制造和组装操作中各种材料、工艺和污染物之间的关系。
20) IPC-SC-60A: 焊接后溶剂的清洗手册。给出了在自动焊接和手工焊接中溶剂清洗技术的使用，讨论了溶剂的性质，残留物以及过程控制和环境方面的问题。
21) IPC-9201: 表面绝缘电阻手册。包含了表面绝缘电阻(SIR) 的术语、理论、测试过程和测试手段，还包括温度、湿度(TH) 测试，故障模式及故障排除。
22) IPC-DRM-53: 电子组装桌面参考手册简介。用来说明通孔安装和表面贴装装配技术的图示和照片。
23) IPC-M-103: 表面贴装装配手册标准。该部分包括有关表面贴装的所有21 个IPC 文件。
24) IPC-M-I04: 印制电路板组装手册标准。包含有关印制电路板组装的10个应用最广泛的文件。
25) IPC-CC-830B: 印制电路板组装中电子绝缘化合物的性能和鉴定。护形涂层符合质量及资格的一个工业标准。
26) IPC-S-816: 表面贴装技术工艺指南及清单。该故障排除指南列出了表面贴装组装中遇到的所有类型的工艺问题及其解决方法，包括桥接、漏焊、元器件放置排列不齐等。
27) IPC-CM-770D: 印制电路板元器件安装指南。为印制电路板组装中元器件的准备提供有效的指导，并回顾了相关的标准、影响力和发行情况，包括组装技术(包括手工和自动的以及表面贴装技术和倒装晶片的组装技术)和对后续焊接、清洗和覆膜工艺的考虑。
28) IPC-7129: 每百万机会发生故障数目(DPMO) 的计算及印制电路板组装制造指标。对于计算缺陷和质量相关工业部门一致同意的基准指标;它为计算每百万机会发生故障数目基准指标提供了令人满意的方法。
29) IPC-9261: 印制电路板组装体产量估计以及组装进行中每百万机会发生的故障。定义了计算印制电路板组装进行中每百万机会发生故障的数目的可靠方法，是组装过程中各阶段进行评估的衡量标准。
30) IPC-D-279: 可靠表面贴装技术印制电路板组装设计指南。表面贴装技术和混合技术的印制电路板的可靠性制造过程指南，包括设计思想。
31) IPC-2546: 印制电路板组装中传递要点的组合需求。描述了材料运动系统，例如传动器和缓冲器、手工放置、自动丝网印制、粘结剂自动分发、自动表面贴装放置、自动镀通孔放置、强迫对流、红外回流炉和波峰焊接。
32) IPC-PE-740A: 印制电路板制造和组装中的故障排除。包括印制电路产品在设计、制造、装配和测试过程中出现问题的案例记录和校正活动。
33) IPC-6010: 印制电路板质量标准和性能规范系列手册。包括美国印制电路板协会为所有印制电路板制定的质量标准和性能规范标准。
34) IPC-6018A: 微波成品印制电路板的检验和测试。包括高频(微波)印制电路板的性能和资格需求。
35) IPC-D-317A: 采用高速技术电子封装设计导则。为高速电路的设计提供指导，包括机械和电气方面的考虑以及性能测试。