中文版 | English

Technology

• Laser marking compared with the advantages and disadvantages of traditional processing
• Reduce the vehicle PCB defect rate of the six major methods
• Why should the PCB board "paste gold"
• PCB hole without copper bad analysis
• Some small principles of PCB copying process
• Double-sided Process
• Multi Version Technique
• Process technology index
• Assurance process
• Management System
• The Inspection and Test
• Printed circuit boards introduce common standards
• PCB design: to reduce noise and electromagnetic interference 24 tips
• Factors affecting impedance PCB processing
• Circuit board gold-plated zedoary relevant comparison
• The difference between gold and gold-plated PCB board Shen board
• PCB circuit board inspection and prevention of short circuit
• The hole broke, the hole wall with copper particles, there are copper, I would like to ask that a few pots of medicine out of the question?
• How to maintain the circuit board to extend the service life

PCB under normal design conditions, the following main factors affecting the impedance PCB manufacturing: 
1, the dielectric layer thickness is proportional to the impedance. 
2, the dielectric constant is inversely proportional to the impedance value. 
3, the impedance value is inversely proportional to the thickness of the copper foil. 
4, line width and impedance value is inversely proportional. 
5, the impedance value is inversely proportional to the thickness of the ink. 
So we should pay attention when the controlled impedance above points.