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The difference between gold and gold-plated PCB board Shen board
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Shen gold plate and gold plate is now commonly used in circuit board production process. With the increasing integration of IC, IC foot the more dense. The vertical HASL process is difficult to become thin flat pad blow, which brought to the SMT placement difficulty; another HASL board stand-life (shelf life) is very short. The gold plate just to solve these problems. For surface mount technology, especially for 0603 and 0402 ultra-compact surface mount, because the flatness of the pad is directly related to the quality of the solder paste printing process, reflow soldering on the back of quality plays a decisive influence, so the entire board gold in high density and ultra-compact surface mount process often seen. In the trial phase, affected by factors such as component procurement is often not the board came immediately welding, but often have to wait a few weeks or even a month or only use, stand-life gilded panels (shelf life) longer than the tin plate many times. So we are willing to adopt. Besides gold-plated PCB in degree and kind of stage cost almost the same compared to the pewter plate. First, what is gilded: the entire board gold. Generally refers to the [gold] [electroless nickel plating gold plate], [electrolytic gold], [electric gold], [board] electroless nickel gold, soft gold and hard gold (generally used as Goldfinger) distinction. The principle is that the nickel and gold (gold salts commonly known) is dissolved in the chemical solution, the circuit board is immersed in the plating tank, and the current generated through the gold plating on the nickel foil surface of the circuit board, because the electroless nickel plating gold high hardness, wear resistance, easily oxidized features in electronic products widely used name.
What is Shen Jin: Method reduction reaction layer coatings by chemical oxidation, generally thicker, is a chemical nickel gold layer deposition method can achieve a thicker layer of gold, usually called Immersion Gold.
The difference between gold plate and gold plate Shen's
1, Shen gold and gilded crystal structure formed is not the same, gold for gold gilded much thicker than the thickness, gold will be a golden yellow is more yellow than the gold-plated customer satisfaction.
2, immersion gold and gilded crystal structure formed is not the same, gold is easier than the gold-plated soldering, no adverse welding, causing customer complaints. Immersion Gold board easier to control stress, to have the bonding of products, more conducive to bonding processing. But also because of heavy gold than gold-plated soft, so gold-plate do not wear Goldfinger.
3, Nickel Immersion Gold board only has gold on the pad, the transmission of signals in the skin effect in copper layer does not affect the signal.
4, gold is gold-plated crystal structure than the more dense and difficult to oxide production.
5, with the wiring and more dense, line width, spacing has come to 3-4MIL. Gold plating a short circuit is likely to occur. Nickel Immersion Gold board only has gold on the pad, it will not yield a gold short circuit.
6, Immersion Gold board only has a nickel-gold on the pad, so the combination of solder and copper layer on a firmer line. The project will not have an impact on the pitch when making compensation.
What is Shen Jin: Method reduction reaction layer coatings by chemical oxidation, generally thicker, is a chemical nickel gold layer deposition method can achieve a thicker layer of gold, usually called Immersion Gold.
The difference between gold plate and gold plate Shen's
1, Shen gold and gilded crystal structure formed is not the same, gold for gold gilded much thicker than the thickness, gold will be a golden yellow is more yellow than the gold-plated customer satisfaction.
2, immersion gold and gilded crystal structure formed is not the same, gold is easier than the gold-plated soldering, no adverse welding, causing customer complaints. Immersion Gold board easier to control stress, to have the bonding of products, more conducive to bonding processing. But also because of heavy gold than gold-plated soft, so gold-plate do not wear Goldfinger.
3, Nickel Immersion Gold board only has gold on the pad, the transmission of signals in the skin effect in copper layer does not affect the signal.
4, gold is gold-plated crystal structure than the more dense and difficult to oxide production.
5, with the wiring and more dense, line width, spacing has come to 3-4MIL. Gold plating a short circuit is likely to occur. Nickel Immersion Gold board only has gold on the pad, it will not yield a gold short circuit.
6, Immersion Gold board only has a nickel-gold on the pad, so the combination of solder and copper layer on a firmer line. The project will not have an impact on the pitch when making compensation.
7, the general requirements for the relatively high board, flatness is better, generally on the use of Immersion Gold, Immersion Gold generally does not appear the phenomenon of black mat after assembly. Immersion Gold board of smoothness and inactive life with gilded plate as well.
Nanjing DingYing Electronics Technology Co., Ltd.